Invention Grant
US08759880B2 Ultra-high voltage SIGE HBT device and manufacturing method of the same
有权
超高电压SIGE HBT器件及其制造方法相同
- Patent Title: Ultra-high voltage SIGE HBT device and manufacturing method of the same
- Patent Title (中): 超高电压SIGE HBT器件及其制造方法相同
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Application No.: US13911375Application Date: 2013-06-06
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Publication No.: US08759880B2Publication Date: 2014-06-24
- Inventor: Jing Shi , Donghua Liu , Jun Hu , Wensheng Qian , Wenting Duan , Fan Chen
- Applicant: Shanghai Hua Hong NEC Electronics Co., Ltd
- Applicant Address: CN Shanghai
- Assignee: Shanghai Hua Hong NEC Electronics Co., Ltd.
- Current Assignee: Shanghai Hua Hong NEC Electronics Co., Ltd.
- Current Assignee Address: CN Shanghai
- Agency: MKG, LLC
- Priority: CN201210187217 20120608
- Main IPC: H01L29/737
- IPC: H01L29/737 ; H01L29/38 ; H01L29/417

Abstract:
An ultra-high voltage silicon-germanium (SiGe) heterojunction bipolar transistor (HBT), which includes: a P-type substrate; an N-type matching layer, a P-type matching layer and an N− collector region stacked on the P-type substrate from bottom up; two field oxide regions separately formed in the N− collector region; N+ pseudo buried layers, each under a corresponding one of the field oxide regions and in contact with each of the N-type matching layer, the P-type matching layer and the N− collector region; an N+ collector region between the two field oxide regions and through the N− collector region and the P-type matching layer and extending into the N-type matching layer; and deep hole electrodes, each in a corresponding one of the field oxide regions and in contact with a corresponding one of the N+ pseudo buried layers. A method of fabricating an ultra-high voltage SiGe HBT is also disclosed.
Public/Granted literature
- US20130328108A1 ULTRA-HIGH VOLTAGE SIGE HBT DEVICE AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2013-12-12
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