Invention Grant
- Patent Title: Super trench schottky barrier schottky diode
- Patent Title (中): 超级沟槽肖特基势垒肖特基二极管
-
Application No.: US13691038Application Date: 2012-11-30
-
Publication No.: US08759888B2Publication Date: 2014-06-24
- Inventor: Ning Qu , Alfred Goerlach
- Applicant: Ning Qu , Alfred Goerlach
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102011087596 20111201
- Main IPC: H01L29/80
- IPC: H01L29/80 ; H01L31/112

Abstract:
A Schottky diode includes an n+-substrate, an n-epilayer, trenches introduced into the n-epilayer, floating Schottky contacts being located on their side walls and on the entire trench bottom, mesa regions between the adjacent trenches, a metal layer on its back face, this metal layer being used as a cathode electrode, and an anode electrode on the front face of the Schottky diode having two metal layers, the first metal layer of which forms a Schottky contact and the second metal layer of which is situated below the first metal layer and also forms a Schottky contact. Preferably, these two Schottky contacts have different barrier heights.
Public/Granted literature
- US20130161779A1 SUPER TRENCH SCHOTTKY BARRIER SCHOTTKY DIODE Public/Granted day:2013-06-27
Information query
IPC分类: