Invention Grant
- Patent Title: Reconfigurable semiconductor integrated circuit
- Patent Title (中): 可重构半导体集成电路
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Application No.: US13471008Application Date: 2012-05-14
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Publication No.: US08760191B2Publication Date: 2014-06-24
- Inventor: Toshirou Kitaoka
- Applicant: Toshirou Kitaoka
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-020406 20100201
- Main IPC: H03K19/173
- IPC: H03K19/173

Abstract:
A semiconductor integrated circuit includes: a plurality of the functional blocks; a plurality of configuration data memories in which a plurality of configuration data are stored; and a plurality of programmable switches configured to control connection between said plurality of functional blocks based on one of the plurality of configuration data which is stored in a common one of said plurality of configuration data memories.
Public/Granted literature
- US20120223737A1 RECONFIGURABLE SEMICONDUCTOR INTEGRATED CIRCUIT Public/Granted day:2012-09-06
Information query
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