Invention Grant
- Patent Title: Devices having a diamond-like-carbon dielectric
- Patent Title (中): 具有类金刚石碳电介质的器件
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Application No.: US13207267Application Date: 2011-08-10
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Publication No.: US08760844B2Publication Date: 2014-06-24
- Inventor: William G. Baron , Jeffrey A. Brogan , Sandra Fries-Carr , Richard J. Gambino , Christopher Gouldstone , Brian Keyes , Sanjay Sampath , Huey-Daw Wu , Richard L. C. Wu
- Applicant: William G. Baron , Jeffrey A. Brogan , Sandra Fries-Carr , Richard J. Gambino , Christopher Gouldstone , Brian Keyes , Sanjay Sampath , Huey-Daw Wu , Richard L. C. Wu
- Applicant Address: US NY St. James
- Assignee: Mesoscribe Technologies, Inc.
- Current Assignee: Mesoscribe Technologies, Inc.
- Current Assignee Address: US NY St. James
- Agency: F. Chau & Associates, LLC
- Main IPC: H01G4/06
- IPC: H01G4/06 ; H01G9/00
Abstract:
A structural capacitor includes a first carbon fiber material layer, a second carbon fiber material layer, and an interlayer dielectric including a diamond-like-carbon material layer.
Public/Granted literature
- US20120039017A1 Devices Having a Diamond-Like-Carbon Dielectric Public/Granted day:2012-02-16
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