Invention Grant
- Patent Title: Flexible modular assembly
- Patent Title (中): 灵活的组装模块
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Application No.: US13133411Application Date: 2009-12-03
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Publication No.: US08760877B2Publication Date: 2014-06-24
- Inventor: Rabin Bhattacharya , Martijn Krans , Liesbeth Van Pieterson , Thomas Schuler , Guido Lamerichs , Erwin Altewischer
- Applicant: Rabin Bhattacharya , Martijn Krans , Liesbeth Van Pieterson , Thomas Schuler , Guido Lamerichs , Erwin Altewischer
- Applicant Address: NL Eindhoven
- Assignee: Koninklijke Philips N.V.
- Current Assignee: Koninklijke Philips N.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP08171032 20081209
- International Application: PCT/IB2009/055478 WO 20091203
- International Announcement: WO2010/067273 WO 20100617
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
The present invention relates to a flexible modular assembly (100) comprising at least two flexible electronic modules (110 and 111) supported by a textile support (130). The two flexible electronic modules and the textile support each comprise a set of electrical conductors. The flexible modular assembly further comprises flexible connectors (140) for interconnecting two sets of electrical conductors. The flexible modular assembly of the invention is a modular textile assembly for use in large-area applications of electronic textiles.
Public/Granted literature
- US20110242771A1 FLEXIBLE MODULAR ASSEMBLY Public/Granted day:2011-10-06
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