Systems and methods are provided that facilitate accurate alignment of internal and external electronic components during assembly of an electronic device such that proper engagement of mating electrical connectors on the respective components is assured. To this end, a floating circuit board carrier mounts to an adaptor plate comprising a surface of the device housing and positions a circuit board such that it “floats” within the device housing. A modular component having posts molded or attached thereto is mounted to the adaptor plate such that the posts pass through clearance holes in the adaptor plate as well as through notches in the circuit board, thereby effecting proper relative alignment of the circuit board and the modular component as electrical connectors on the respective components are engaged.