Invention Grant
US08760901B2 Semiconductor device having a control chip stacked with a controlled chip
有权
具有堆叠有受控芯片的控制芯片的半导体器件
- Patent Title: Semiconductor device having a control chip stacked with a controlled chip
- Patent Title (中): 具有堆叠有受控芯片的控制芯片的半导体器件
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Application No.: US13652030Application Date: 2012-10-15
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Publication No.: US08760901B2Publication Date: 2014-06-24
- Inventor: Yoshiro Riho
- Applicant: Elpida Memory, Inc.
- Agency: Foley & Lardner LLP
- Priority: JP2011-228532 20111018
- Main IPC: G11C7/06
- IPC: G11C7/06 ; G11C7/10 ; G11C7/22 ; G11C5/06 ; G11C29/02 ; H01L25/065

Abstract:
A semiconductor device includes a first controlled chip and a control chip stacked therewith. The first controlled chip includes a first circuit outputting a data signal in response to a synchronization signal, an input/output circuit outputting the data signal to a data terminal in synchronization with a delayed synchronization signal, and a replica circuit replicating an output circuit and outputting a replica signal to a first replica terminal in synchronization with the delayed synchronization signal. The control chip includes a first control circuit outputting a synchronization signal and receiving a data signal, a delay adjustment circuit delaying the synchronization signal and outputting the same as a delayed synchronization signal, a phase comparator circuit comparing the phases of the replica signal and the synchronization signal, and a delay control circuit controlling the delay amount of the delay adjustment circuit based on a comparison result of the phase comparator circuit.
Public/Granted literature
- US20130094272A1 DEVICE Public/Granted day:2013-04-18
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