Invention Grant
- Patent Title: Semiconductor apparatus
- Patent Title (中): 半导体装置
-
Application No.: US13599730Application Date: 2012-08-30
-
Publication No.: US08760943B2Publication Date: 2014-06-24
- Inventor: Toshihiko Funaki , Toshiharu Okamoto , Muneaki Matsushige , Kenichi Kuboyama , Shuuichi Senou , Susumu Takano
- Applicant: Toshihiko Funaki , Toshiharu Okamoto , Muneaki Matsushige , Kenichi Kuboyama , Shuuichi Senou , Susumu Takano
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-188636 20110831
- Main IPC: G11C7/00
- IPC: G11C7/00 ; G11C7/10 ; G11C8/00 ; G11C8/06 ; G11C8/12 ; G11C11/4096

Abstract:
A semiconductor apparatus according to an aspect of the present invention includes first and second bus-interface circuits, a first memory core connected to the first bus-interface circuit through a first data bus, the first memory core being connected to a first access control signal output from the first bus-interface circuit, a second memory core connected to the second bus-interface circuit through a second data bus, and a select circuit that selectively connects one of the first access control signal and a second access control signal output from the second bus-interface circuit to the second memory core.
Public/Granted literature
- US20130051110A1 SEMICONDUCTOR APPARATUS Public/Granted day:2013-02-28
Information query