Invention Grant
US08761669B2 Method and system for chip-to-chip communication via on-chip leaky wave antennas
有权
通过片上泄漏波天线进行芯片间通信的方法和系统
- Patent Title: Method and system for chip-to-chip communication via on-chip leaky wave antennas
- Patent Title (中): 通过片上泄漏波天线进行芯片间通信的方法和系统
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Application No.: US12796822Application Date: 2010-06-09
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Publication No.: US08761669B2Publication Date: 2014-06-24
- Inventor: Ahmadreza Rofougaran , Maryam Rofougaran
- Applicant: Ahmadreza Rofougaran , Maryam Rofougaran
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H04B7/00
- IPC: H04B7/00

Abstract:
Methods and systems for chip-to-chip communication via on-chip leaky wave antennas are provided. In this regard, RF signals may be communicated between a first leaky wave antenna in a first integrated circuit and a second leaky wave antenna in a second integrated circuit, where the first integrated circuit and the second integrated circuit are housed in a single integrated circuit package. The first integrated circuit and the second integrated circuit may be electrically isolated from one another. One or both of the first leaky wave antenna and the second leaky wave antenna may comprise a pair of coplanar conductive lines. Spacing between the coplanar conductive lines may be configured by applying a voltage which causes one or both of the coplanar conductive lines to deflect towards or away from the other one of the coplanar conductive lines.
Public/Granted literature
- US20100311332A1 METHOD AND SYSTEM FOR CHIP-TO-CHIP COMMUNICATION VIA ON-CHIP LEAKY WAVE ANTENNAS Public/Granted day:2010-12-09
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