Invention Grant
- Patent Title: Water cool refrigeration
- Patent Title (中): 水冷制冷
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Application No.: US11985158Application Date: 2007-11-14
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Publication No.: US08763417B2Publication Date: 2014-07-01
- Inventor: Hui Jen Szutu
- Applicant: Hui Jen Szutu
- Main IPC: F28D5/00
- IPC: F28D5/00 ; F25B47/00 ; F25B39/04

Abstract:
The refrigeration system of this invention utilizes a water cooled condenser which is made of multiple water pans with refrigeration coil soldered underneath for multi-stages cooling. The water pans are stacked on top of each other with the hottest coil located at the bottom. The bottom water pan dries up water faster than the other water pans since it has the hottest coil soldered underneath. Once the water level of the bottom water pan is low enough to be refilled, the supply water fills in from the top water pan and propagating downward to the water pan down below until it reaches the water pan at the bottom. The water refilling ceases once the bottom water pan is full. The unwanted heat from a refrigeration system is transferred from the refrigerant to the water, and then from the water to the air by evaporation.
Public/Granted literature
- US20090120121A1 Water cool refrigeration Public/Granted day:2009-05-14
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