Invention Grant
- Patent Title: Pressure sensor device
- Patent Title (中): 压力传感器装置
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Application No.: US13419543Application Date: 2012-03-14
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Publication No.: US08763467B2Publication Date: 2014-07-01
- Inventor: Takuya Ishihara , Hidefumi Harada , Masashi Sekine
- Applicant: Takuya Ishihara , Hidefumi Harada , Masashi Sekine
- Applicant Address: JP Tokyo
- Assignee: Azbil Corporation
- Current Assignee: Azbil Corporation
- Current Assignee Address: JP Tokyo
- Agency: Troutman Sanders LLP
- Priority: JP2011-078478 20110331
- Main IPC: G01L9/12
- IPC: G01L9/12 ; G01L9/00

Abstract:
A pressure sensor device has a sensor detecting pressure of a gas that is introduced from the outside, a heater for heating the sensor, a package containing the sensor and the heater, a circuit portion producing an output signal that represents the pressure of the gas based on the detection output detected by the sensor, and a circuit containing portion containing the circuit portion. The package and the circuit containing portion are structured from separate cases and are disposed separately with a connecting structural member interposed therebetween. The connecting structural member 90 includes electrode lead pins connecting between the sensor within the package and the circuit portion within the circuit containing portion, insulated pipes for covering the outer peripheries of the electrode lead pins, and coil springs covering the outer peripheries of the insulated pipes.
Public/Granted literature
- US20120247216A1 PRESSURE SENSOR DEVICE Public/Granted day:2012-10-04
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