A device for dissipating heat away from a heat sensitive component includes a heat dissipation member thermally coupled to a heat sensitive component. The heat dissipation member may be formed of a composite material. In aspects, the device may be include an enclosure coupled to a conveyance device; a heat sensitive component disposed in the enclosure; and a composite heat dissipation member thermally coupled to the heat sensitive component. The composite heat dissipation member may include a metal and a non-metal. The apparatus may also include an encapsulation substantially encapsulating the heat dissipation member and the heat sensitive component.