Invention Grant
US08763884B2 Joint with first and second members with a joining layer located therebetween containing Sn metal and another metallic material; methods for forming the same joint
有权
与第一和第二构件接合，其中位于其间的接合层包含Sn金属和另一种金属材料; 形成同一关节的方法
- Patent Title: Joint with first and second members with a joining layer located therebetween containing Sn metal and another metallic material; methods for forming the same joint
- Patent Title (中): 与第一和第二构件接合，其中位于其间的接合层包含Sn金属和另一种金属材料; 形成同一关节的方法
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Application No.: US13960242Application Date: 2013-08-06
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Publication No.: US08763884B2Publication Date: 2014-07-01
- Inventor: Toshihide Takahashi , Tatsuoki Kono , Mitsuhiro Oki , Akiko Suzuki
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Amin, Turocy & Watson, LLP
- Priority: JP2006-266600 20060929; JP2007-064669 20070314
- Main IPC: B23K31/02
- IPC: B23K31/02
Abstract:
The present invention relates to a joint (10) that includes a first member (11) to be jointed, a second member (12) to be jointed and a jointing layer (13) located between the first member (11) and the second member (12). The jointing layer (13) is made of Sn metal and a metallic material with a melting point higher than the melting point of the Sn metal. The present invention relates also to a method of joining this first member (11) to the second member (12).
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