Invention Grant
- Patent Title: Modular bumper system
- Patent Title (中): 模块式保险杠系统
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Application No.: US13760143Application Date: 2013-02-06
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Publication No.: US08764080B2Publication Date: 2014-07-01
- Inventor: David E. Hardy , Patrick W. Bennett
- Applicant: Omix-Ada, Inc.
- Applicant Address: US GA Suwanee
- Assignee: Omix-Ada
- Current Assignee: Omix-Ada
- Current Assignee Address: US GA Suwanee
- Agency: Womble Carlyle Sandridge & Rice LLP
- Main IPC: B60R19/03
- IPC: B60R19/03

Abstract:
A modular reconfigurable bumper system for an off road vehicle includes a center base mountable to the front of the vehicle. The center base has ends, a top face, and a front face. A pair of first mounting locations having associated mounting holes are located on the front face of the center base adjacent its ends and a pair of second mounting locations having associated mounting holes are located on the top face adjacent the ends of the center base. A pair of third mounting locations are located on the ends of the center base. A plurality of optional accessories including end plates, end extenders, an overrider, a prerunner, a stinger, and D-rings are selectively mountable to the center base, all via the first, second, and third mounting locations. The system also includes a rear bumper assembly mountable to the back of the vehicle and having a hinged spare tire carrier and D-rings selectively attachable to the rear bumper via common fourth mounting locations.
Public/Granted literature
- US20130147215A1 Modular Bumper System Public/Granted day:2013-06-13
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