Invention Grant
- Patent Title: Light module
- Patent Title (中): 灯模块
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Application No.: US12883504Application Date: 2010-09-16
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Publication No.: US08764209B2Publication Date: 2014-07-01
- Inventor: Sintarou Hayasi , Osamu Tanahasi , Satosi Fukano , Shinichi Anami , Shigetsugu Sumiyama , Motohiro Saimi , Hideharu Kawachi
- Applicant: Sintarou Hayasi , Osamu Tanahasi , Satosi Fukano , Shinichi Anami , Shigetsugu Sumiyama , Motohiro Saimi , Hideharu Kawachi
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, PLC
- Priority: JP2009-216557 20090918
- Main IPC: F21K2/00
- IPC: F21K2/00

Abstract:
A light module 1 includes a planar light emitting device 2, a wiring board 3, and an optical sheet 4. The wiring board 3 has a hole 8 for accommodating the planar light emitting device 2. The optical sheet 4 holds the planar light emitting device 2 and the wiring board 3 such that the planar light emitting device 2 accommodated in the hole 8 of the wiring board 3 and the wiring board 3 are flush with each other on the light emitting surface side of the light module 1. The optical sheet 4 holds the planar light emitting device 2 and the wiring board 3, and prevents dust and moisture from entering the inside the light module 1. This eliminates the necessity for the light module 1 to include a casing, packing, and the like. Therefore, the thickness of the module can be reduced.
Public/Granted literature
- US20110069495A1 LIGHT MODULE Public/Granted day:2011-03-24
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