Invention Grant
US08764222B2 Heat dissipating structure of LED circuit board and LED lamp tube comprised thereof
有权
LED电路板的散热结构及其组成的LED灯管
- Patent Title: Heat dissipating structure of LED circuit board and LED lamp tube comprised thereof
- Patent Title (中): LED电路板的散热结构及其组成的LED灯管
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Application No.: US13707445Application Date: 2012-12-06
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Publication No.: US08764222B2Publication Date: 2014-07-01
- Inventor: Kuo-Len Lin , Chen-Hsiang Lin , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
- Applicant: Cpumate Inc.
- Applicant Address: US DE Wilmington
- Assignee: Kitagawa Holdings, LLC
- Current Assignee: Kitagawa Holdings, LLC
- Current Assignee Address: US DE Wilmington
- Agency: Baker & Hostetler LLP
- Main IPC: H01J7/24
- IPC: H01J7/24 ; H05K1/02 ; H05K3/28
Abstract:
A heat dissipating structure of an LED circuit board includes an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered by a coating layer including Nanoparticles and a bonding agent. The coating layer has the characteristics of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board. The LED circuit board covered by the coating layer is placed in an LED lamp tube to provide good heat dissipation effect.
Public/Granted literature
- US20130094201A1 Heat Dissipating Structure Of LED Circuit Board And LED Lamp Tube Comprised Thereof Public/Granted day:2013-04-18
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