LED “Chip-on-Board” (COB) metal core printed circuit board (PCB) technology operates in conjunction with high efficiency compact imaging and non-imaging optics to provide a compact emergency light offering high performance luminance levels (higher brightness) and enhanced life, at low cost. Thermal impedance between the LED junction and the heat sink is significantly reduced for COB technology by placing the LED die directly on a high thermal conductivity material substrate thereby increasing temperature dependant life and thermally dependant output power. Additionally, there is no encapsulant or domed optic over the LED thus making it possible to get a much more compact and efficient substantially Etendue preserving collection optic directly over the die.