Invention Grant
- Patent Title: Electrical device having boardless electrical component mounting arrangement
- Patent Title (中): 具有无板电气元件安装布置的电气设备
-
Application No.: US13039130Application Date: 2011-03-02
-
Publication No.: US08764240B2Publication Date: 2014-07-01
- Inventor: Thomas J. Veenstra , Paul T. Vander Kuyl , Matthew S. Weeda , Michael L. Lanser , Kyle A. Israels , Jason R. Mulder , Mark W. Vander Pol
- Applicant: Thomas J. Veenstra , Paul T. Vander Kuyl , Matthew S. Weeda , Michael L. Lanser , Kyle A. Israels , Jason R. Mulder , Mark W. Vander Pol
- Applicant Address: US MI Zeeland
- Assignee: Innotec Corp.
- Current Assignee: Innotec Corp.
- Current Assignee Address: US MI Zeeland
- Agency: Price Heneveld LLP
- Main IPC: F21V15/00
- IPC: F21V15/00
Abstract:
An electrical device such as an LED light assembly includes a conductive circuit and one or more electrical components connected to the circuit. The electrical components and the circuit are at least partially overmolded with a thermoplastic polymer material to encapsulate the components. The material utilized to cover the circuit and/or electrical components may also be utilized to form a housing or other structure of a finished part.
Public/Granted literature
- US20110146068A1 ELECTRICAL DEVICE HAVING BOARDLESS ELECTRICAL COMPONENT MOUNTING ARRANGEMENT Public/Granted day:2011-06-23
Information query
