Invention Grant
- Patent Title: Shape memory thermal sensors
- Patent Title (中): 形状记忆热传感器
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Application No.: US13155592Application Date: 2011-06-08
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Publication No.: US08764286B2Publication Date: 2014-07-01
- Inventor: Frederick B. Koehler , Ward D. Lyman
- Applicant: Frederick B. Koehler , Ward D. Lyman
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: G01K1/00
- IPC: G01K1/00 ; G01K13/12

Abstract:
Embodiments of separating apparatuses are generally described herein. Other embodiments may be described and claimed. In one embodiment, a thermal sensor assembly includes a shape memory substrate anchored within an isolation housing and braced between first and second anchors. The shape memory substrate is configured to transition from the strained configuration to the fractured configuration at a specified temperature range, and the first substrate end fractures from the second substrate end at the specified temperature. In another embodiment, a fracture indicator is coupled with the shape memory substrate, and the fracture indicator is configured to indicate the fractured configuration corresponding to meeting or exceeding of the specified temperature. In one example, the specified temperature range includes a range of temperatures or a single temperature.
Public/Granted literature
- US20110232562A1 SHAPE MEMORY THERMAL SENSORS Public/Granted day:2011-09-29
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