Invention Grant
- Patent Title: Vacuum buffer assembly
- Patent Title (中): 真空缓冲装置
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Application No.: US13927997Application Date: 2013-06-26
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Publication No.: US08764520B1Publication Date: 2014-07-01
- Inventor: William A. Fields
- Applicant: Surtec, Inc.
- Applicant Address: US CA Tracy
- Assignee: Surtec, Inc.
- Current Assignee: Surtec, Inc.
- Current Assignee Address: US CA Tracy
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: B24B55/06
- IPC: B24B55/06

Abstract:
Disclosed are improvements to a high speed power buffer assembly provided with a dust evacuation system. The assembly includes a hood depending from the chassis to encircle the high speed rotating buffer pad, a peripheral skirt depended from the chassis, a dust collection aperture adjacent the buffer penetrating the hood for the outlet of dust to the exterior of the hood, a curved dust collector chute, aligned and in communication with the dust collection aperture, and a dust collection bag, communicated with the dust collector output. The skirt has inclined grooves to co-act with the buffer pad to entrain air from the outside of the skirt to the inside. Given the arrangement of the foregoing features, the dust evacuation system can operate without the use of a vacuum pump.
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