Invention Grant
US08764529B2 Arrangement and method to sense flow using mechanical stress microsensors
有权
使用机械应力微传感器检测流动的布置和方法
- Patent Title: Arrangement and method to sense flow using mechanical stress microsensors
- Patent Title (中): 使用机械应力微传感器检测流动的布置和方法
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Application No.: US12220848Application Date: 2008-07-29
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Publication No.: US08764529B2Publication Date: 2014-07-01
- Inventor: Matthew D. Cook , Dean B. Anderson
- Applicant: Matthew D. Cook , Dean B. Anderson
- Applicant Address: US GA Alpharetta
- Assignee: Siemens Industry, Inc.
- Current Assignee: Siemens Industry, Inc.
- Current Assignee Address: US GA Alpharetta
- Main IPC: F24F11/00
- IPC: F24F11/00

Abstract:
A sensor module includes a MEMs sensor device and a processing circuit. The MEMs sensor device is operable to determine a fluid flow induced mechanical force on a first flow control device connective element. The processing circuit is operably coupled to receive fluid flow induced mechanical force information based on the determined fluid flow induced mechanical force. The processing circuit is configured to generate a fluid flow measurement value based on the fluid flow induced mechanical force information and position information representative of a position of a flow control device coupled to the first flow control connective element.
Public/Granted literature
- US20080287052A1 Arrangement and method to sense flow using mechanical stress microsensors Public/Granted day:2008-11-20
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