Invention Grant
- Patent Title: Placing sutures
- Patent Title (中): 放置缝线
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Application No.: US13687223Application Date: 2012-11-28
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Publication No.: US08764771B2Publication Date: 2014-07-01
- Inventor: Michael S. H. Chu
- Applicant: Boston Scientific Scimed, Inc.
- Applicant Address: US MN Maple Grove
- Assignee: Boston Scientific Scimed, Inc.
- Current Assignee: Boston Scientific Scimed, Inc.
- Current Assignee Address: US MN Maple Grove
- Main IPC: A61B17/04
- IPC: A61B17/04 ; A61B17/10

Abstract:
A suturing instrument is configured for to apply sutures to approximate, ligate, or fixate tissue in, for example, open, mini-incision, trans-vaginal, or endoscopic surgical procedures. The suturing instrument includes an elongate body member, a needle exit port, a needle receiving port, and a needle deployment mechanism. The suturing instrument eliminates the need for a preassembled needle and suture and reduces or eliminates the possibility of needle loss during suturing.
Public/Granted literature
- US20130103056A1 PLACING SUTURES Public/Granted day:2013-04-25
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