Invention Grant
- Patent Title: Removing a sheet from the surface of a melt using elasticity and buoyancy
- Patent Title (中): 使用弹性和浮力从熔体表面去除片材
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Application No.: US13039808Application Date: 2011-03-03
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Publication No.: US08764901B2Publication Date: 2014-07-01
- Inventor: Peter L. Kellerman , Dawei Sun , Brian Helenbrook , David S. Harvey
- Applicant: Peter L. Kellerman , Dawei Sun , Brian Helenbrook , David S. Harvey
- Applicant Address: US MA Gloucester
- Assignee: Varian Semiconductor Equipment Associates, Inc.
- Current Assignee: Varian Semiconductor Equipment Associates, Inc.
- Current Assignee Address: US MA Gloucester
- Main IPC: C30B15/06
- IPC: C30B15/06 ; C30B15/00 ; C30B15/20 ; C30B15/22
Abstract:
Embodiments related to sheet production are disclosed. A melt of a material is cooled to form a sheet of the material on the melt. The sheet is formed in a first region at a first sheet height. The sheet is translated to a second region such that it has a second sheet height higher than the first sheet height. The sheet is then separated from the melt. A seed wafer may be used to form the sheet.
Public/Granted literature
- US20110272115A1 REMOVING A SHEET FROM THE SURFACE OF A MELT USING ELASTICITY AND BUOYANCY Public/Granted day:2011-11-10
Information query
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