Invention Grant
- Patent Title: Surface treatment of an organic or inorganic substrate for enhancing stability of a lithographically defined deposited metal layer
- Patent Title (中): 有机或无机基材的表面处理，用于增强光刻定义的沉积金属层的稳定性
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Application No.: US12835011Application Date: 2010-07-13
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Publication No.: US08764997B2Publication Date: 2014-07-01
- Inventor: Fabrizio Porro , Luigi Giuseppe Occhipinti
- Applicant: Fabrizio Porro , Luigi Giuseppe Occhipinti
- Applicant Address: IT Agrate Brianza (MB)
- Assignee: STMicroelectronics S.R.L.
- Current Assignee: STMicroelectronics S.R.L.
- Current Assignee Address: IT Agrate Brianza (MB)
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A. Attorneys at Law
- Priority: ITVA2009A0049 20090713
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/461 ; H01L21/311 ; H01B13/00 ; C03C15/00 ; C03C25/68 ; C23F1/00
Abstract:
A method of metal deposition may include chemically modifying a surface of a substrate to make the surface hydrophobic. The method may further include depositing a layer of metal over the hydrophobic surface and masking at least a portion of the deposited metal layer to define a conductive metal structure. The method may also include using an etching agent to etch unmasked portions of the deposited metal layer.
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Information query
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