Invention Grant
- Patent Title: Polymer composition
- Patent Title (中): 聚合物组成
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Application No.: US12598614Application Date: 2008-05-02
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Publication No.: US08765027B2Publication Date: 2014-07-01
- Inventor: David Lussey , David Bloor , Paul Laughlin , Cyril Hilsum
- Applicant: David Lussey , David Bloor , Paul Laughlin , Cyril Hilsum
- Applicant Address: GB Brompton on Swale, Richmond
- Assignee: Peratech Limited
- Current Assignee: Peratech Limited
- Current Assignee Address: GB Brompton on Swale, Richmond
- Agent Arthur Jacob
- Priority: GB0708702.6 20070504
- International Application: PCT/GB2008/050323 WO 20080502
- International Announcement: WO2008/135787 WO 20081113
- Main IPC: H01B1/00
- IPC: H01B1/00 ; H01B1/12 ; H01B1/02 ; H01B1/22 ; H01B1/08 ; H01C10/10

Abstract:
A polymer composition comprises at least one substantially non-conductive polymer binder and at least first and second electrically conductive fillers. The first electrically conductive filler is comprised of particles having avoid-bearing structure; and the second electrically conductive filler is comprised of particles which are acicular in shape.
Public/Granted literature
- US20110253948A1 Polymer Composition Public/Granted day:2011-10-20
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