Invention Grant
US08765053B2 Sn based alloys with fine compound inclusions for Nb3Sn superconducting wires 有权
用于Nb3Sn超导线材的具有精细复合夹杂物的Sn基合金

  • Patent Title: Sn based alloys with fine compound inclusions for Nb3Sn superconducting wires
  • Patent Title (中): 用于Nb3Sn超导线材的具有精细复合夹杂物的Sn基合金
  • Application No.: US12656347
    Application Date: 2010-01-27
  • Publication No.: US08765053B2
    Publication Date: 2014-07-01
  • Inventor: Florin Buta
  • Applicant: Florin Buta
  • Applicant Address: CH Faellanden
  • Assignee: Bruker BioSpin AG
  • Current Assignee: Bruker BioSpin AG
  • Current Assignee Address: CH Faellanden
  • Agent Paul Vincent
  • Priority: EP09157054 20090401
  • Main IPC: C22C13/00
  • IPC: C22C13/00 C22C1/00
Sn based alloys with fine compound inclusions for Nb3Sn superconducting wires
Abstract:
A method for producing a Sn based alloy (15) comprising a metal matrix of a metal matrix material, wherein the metal matrix material comprises Sn, and inclusions of a compound material, further referred to as compound inclusions, wherein the compound material contains one element or a combination of elements of the group Ti, V, Zr, Hf, further referred to as dopant, and one or a plurality of other elements, in particular Sn, Cu and/or Nb. Particles of the metal matrix material, further referred to as matrix particles, are mixed with particles of the compound material, further referred to as compound particles, and the matrix particles and the compound particles are compacted during and/or after their mixing. A Sn based alloy containing finer compound inclusion of a dopant can be prepared, in order to produce Nb3Sn superconductor material with a superior current carrying capacity.
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