Invention Grant
- Patent Title: Biochip stamping device and stamping method thereof
- Patent Title (中): 生物芯片冲压装置及其冲压方法
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Application No.: US13358880Application Date: 2012-01-26
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Publication No.: US08765078B2Publication Date: 2014-07-01
- Inventor: Sang Youl Jeon , Bo Sung Ku , Hee Ju Son
- Applicant: Sang Youl Jeon , Bo Sung Ku , Hee Ju Son
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2011-0086521 20110829
- Main IPC: G01N21/01
- IPC: G01N21/01 ; G01N21/00 ; G01N33/48 ; B01L99/00
Abstract:
There is provided a biochip stamping device. The biochip stamping device includes a stamping jig in which a first biochip is aligned; an inverting mechanism vertically inverting a second biochip; and a movement mechanism transferring the vertically inverted second biochip on the stamping jig to combine the first biochip and the second biochip.
Public/Granted literature
- US20130047399A1 BIOCHIP STAMPING DEVICE AND STAMPING METHOD THEREOF Public/Granted day:2013-02-28
Information query
