The invention relates to a molding compound including a polyester resin composition, ABS components, waxes, matting agents and optionally vegetable oil, which is used to produce films with a low luster, improved thermal resistance of the film and/or of the surface structure and an increased shrinking onset temperature, in addition to a modified shrinkage progression in comparison to films without the aforementioned additives. The fraction of the polyester resin composition is between 30 and 97 wt. % and the fraction of the additives between 1.5 and 70 wt. %, in relation to the total weight of the molding compound. The films are used as shrink-wrapping and packaging films and films for furniture and printed circuit boards.