Invention Grant
US08765264B2 Silicone laminated substrate, method of producing same, silicone resin composition for producing silicone laminated substrate, and LED device
有权
有机硅层压基板及其制造方法,硅树脂层叠基板用有机硅树脂组合物及LED装置
- Patent Title: Silicone laminated substrate, method of producing same, silicone resin composition for producing silicone laminated substrate, and LED device
- Patent Title (中): 有机硅层压基板及其制造方法,硅树脂层叠基板用有机硅树脂组合物及LED装置
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Application No.: US12557209Application Date: 2009-09-10
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Publication No.: US08765264B2Publication Date: 2014-07-01
- Inventor: Tsutomu Kashiwagi , Toshio Shiobara
- Applicant: Tsutomu Kashiwagi , Toshio Shiobara
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2008-233102 20080911; JP2008-233103 20080911
- Main IPC: C08K3/22
- IPC: C08K3/22 ; C08L83/06 ; B32B27/28 ; B32B17/04 ; H01L23/14

Abstract:
Silicone-laminated substrate, including glass cloth, and cured product of silicone resin composition—with which the glass cloth is filled and a surface of the glass cloth is coated. The silicone resin composition includes: (A) an organopolysiloxane having a resin structure of specific siloxane units, (B) an organohydrogenpolysiloxane having a resin structure of specific siloxane units, (C) a platinum group metal-based catalyst, and (D) a filler. The silicone-laminated substrate exhibits excellent mechanical properties, flexibility and workability, has minimal surface tack, and is easy to handle. The silicone-laminated substrate is produced by impregnating a glass cloth with the silicone resin composition dissolved or dispersed in a solvent, subsequently evaporating the solvent from the glass cloth, and subjecting the composition impregnated into the glass cloth to heat-curing under compression-molding conditions. Also, an LED device which includes the silicone-laminated substrate and an LED chip mounted on top of the substrate.
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