Invention Grant
- Patent Title: Electrochemical device and packaging structure thereof
- Patent Title (中): 电化学装置及其包装结构
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Application No.: US12990633Application Date: 2009-05-07
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Publication No.: US08765277B2Publication Date: 2014-07-01
- Inventor: Kazushi Yawata , Motoki Kobayashi , Katsuei Ishida , Naoto Hagiwara
- Applicant: Kazushi Yawata , Motoki Kobayashi , Katsuei Ishida , Naoto Hagiwara
- Applicant Address: JP Tokyo
- Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Law Office of Katsuhiro Arai
- Priority: JP2008-122314 20080508
- International Application: PCT/JP2009/058958 WO 20090507
- International Announcement: WO2009/136660 WO 20091112
- Main IPC: H01M2/12
- IPC: H01M2/12 ; H01M2/30

Abstract:
Provided is an electrochemical device which is compatible with high-temperature reflow soldering using lead-free solder. An electric double-layer capacitor 10-1 has a structure in which a positive terminal 12 and a negative terminal 13 are led out of a package 14 where an electric storage element 11 is sealed. The entire package 14 and the bases of led-out portions of the positive terminal 12 and the negative terminal 13 are covered by a thermal insulation material layer 16 having a thermal conductivity lower than that of the package 14.
Public/Granted literature
- US20110045327A1 ELECTROCHEMICAL DEVICE AND PACKAGING STRUCTURE THEREOF Public/Granted day:2011-02-24
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