Invention Grant
US08765355B2 Radiation sensitive resin composition, method for forming a pattern, polymer and compound
有权
辐射敏感性树脂组合物，形成图案的方法，聚合物和化合物
- Patent Title: Radiation sensitive resin composition, method for forming a pattern, polymer and compound
- Patent Title (中): 辐射敏感性树脂组合物，形成图案的方法，聚合物和化合物
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Application No.: US13459023Application Date: 2012-04-27
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Publication No.: US08765355B2Publication Date: 2014-07-01
- Inventor: Takakazu Kimoto , Mitsuo Sato , Yusuke Asano , Tomohiro Kakizawa
- Applicant: Takakazu Kimoto , Mitsuo Sato , Yusuke Asano , Tomohiro Kakizawa
- Applicant Address: JP Tokyo
- Assignee: JSR Corporation
- Current Assignee: JSR Corporation
- Current Assignee Address: JP Tokyo
- Agency: Ditthavong & Steiner, P.C.
- Priority: JP2011-102492 20110428
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/30 ; C08F12/20
Abstract:
A radiation sensitive resin composition includes a first polymer having a group represented by a following formula (1), and a radiation sensitive acid generator. n is an integer of 2 to 4. X represents a single bond or a bivalent organic group. A represents a (n+1) valent linking group. Each Q independently represents a group that includes an alkali-dissociable group.
Public/Granted literature
- US20120276482A1 RADIATION SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING A PATTERN, POLYMER AND COMPOUND Public/Granted day:2012-11-01
Information query
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