Invention Grant
US08765498B2 Method of manufacturing liquid discharge head substrate, method of manufacturing liquid discharge head, and method of manufacturing liquid discharge head assembly 有权
液体排出头基板的制造方法,液体排出头的制造方法以及液体排出头组件的制造方法

  • Patent Title: Method of manufacturing liquid discharge head substrate, method of manufacturing liquid discharge head, and method of manufacturing liquid discharge head assembly
  • Patent Title (中): 液体排出头基板的制造方法,液体排出头的制造方法以及液体排出头组件的制造方法
  • Application No.: US13106593
    Application Date: 2011-05-12
  • Publication No.: US08765498B2
    Publication Date: 2014-07-01
  • Inventor: Masataka Kato
  • Applicant: Masataka Kato
  • Applicant Address: JP Tokyo
  • Assignee: Canon Kabushiki Kaisha
  • Current Assignee: Canon Kabushiki Kaisha
  • Current Assignee Address: JP Tokyo
  • Agency: Canon USA Inc. IP Division
  • Priority: JP2010-115350 20100519
  • Main IPC: H01L21/00
  • IPC: H01L21/00
Method of manufacturing liquid discharge head substrate, method of manufacturing liquid discharge head, and method of manufacturing liquid discharge head assembly
Abstract:
A method of manufacturing a liquid discharge head substrate, includes forming an etching mask layer having an opening in a shape corresponding to a plurality of second portions on a second plane of the substrate, forming a recess to be a first portion by etching the substrate through the opening of the etching mask layer from a second plane side of the substrate, and forming the plurality of second portions by etching a portion from a bottom of a first portion to a first plane using the etching mask layer as a mask from the second plane side of the substrate to form a liquid supply port passing through the substrate.
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