Invention Grant
- Patent Title: Method of manufacturing liquid discharge head substrate, method of manufacturing liquid discharge head, and method of manufacturing liquid discharge head assembly
- Patent Title (中): 液体排出头基板的制造方法,液体排出头的制造方法以及液体排出头组件的制造方法
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Application No.: US13106593Application Date: 2011-05-12
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Publication No.: US08765498B2Publication Date: 2014-07-01
- Inventor: Masataka Kato
- Applicant: Masataka Kato
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon USA Inc. IP Division
- Priority: JP2010-115350 20100519
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method of manufacturing a liquid discharge head substrate, includes forming an etching mask layer having an opening in a shape corresponding to a plurality of second portions on a second plane of the substrate, forming a recess to be a first portion by etching the substrate through the opening of the etching mask layer from a second plane side of the substrate, and forming the plurality of second portions by etching a portion from a bottom of a first portion to a first plane using the etching mask layer as a mask from the second plane side of the substrate to form a liquid supply port passing through the substrate.
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Information query
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