Invention Grant
- Patent Title: Method of manufacturing an integrated circuit packaging system including lasering through encapsulant over interposer
- Patent Title (中): 制造集成电路封装系统的方法，包括通过封装在内插器上的激光
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Application No.: US13162566Application Date: 2011-06-16
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Publication No.: US08765525B2Publication Date: 2014-07-01
- Inventor: In Sang Yoon , DeokKyung Yang , Sungmin Song
- Applicant: In Sang Yoon , DeokKyung Yang , Sungmin Song
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of manufacture of an integrated packaging system includes: providing a substrate; mounting an integrated circuit on the substrate; mounting an interposer substrate having an interposer pad on the integrated circuit; covering an encapsulant over the integrated circuit and the interposer substrate; forming a hole through the encapsulant aligned over the interposer pad; and placing a conductive connector on and in direct contact with the interposer pad.
Public/Granted literature
- US20120319265A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MOLDED LASER VIA INTERPOSER AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2012-12-20
Information query
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