Invention Grant
US08765526B2 Method of manufacturing semiconductor device including plural semiconductor chips stacked together
失效
制造半导体器件的方法包括堆叠在一起的多个半导体芯片
- Patent Title: Method of manufacturing semiconductor device including plural semiconductor chips stacked together
- Patent Title (中): 制造半导体器件的方法包括堆叠在一起的多个半导体芯片
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Application No.: US13333328Application Date: 2011-12-21
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Publication No.: US08765526B2Publication Date: 2014-07-01
- Inventor: Akira Ide
- Applicant: Akira Ide
- Agency: Foley & Lardner LLP
- Priority: JP2010-288037 20101224
- Main IPC: H01L21/50
- IPC: H01L21/50
Abstract:
Such a method is disclosed that includes preparing first and second semiconductor chips, the first semiconductor chip including a first electrode formed on one surface thereof and a second electrode formed on the other surface thereof so as to overlap the first electrode as viewed from a stacking direction, and the second semiconductor chip including a third electrode formed on one surface thereof and a fourth electrode formed on the other surface thereof so as not to overlap the third electrode as viewed from the stacking direction, and stacking the first and second semiconductor chips in the stacking direction so that the second electrode is connected to the third electrode by using a bonding tool including a concave at a position corresponding to the fourth electrode.
Public/Granted literature
- US20120164788A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING PLURAL SEMICONDUCTOR CHIPS STACKED TOGETHER Public/Granted day:2012-06-28
Information query
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