Invention Grant
US08765541B1 Integrated circuit and a method to optimize strain inducing composites
有权
集成电路和优化应变诱导复合材料的方法
- Patent Title: Integrated circuit and a method to optimize strain inducing composites
- Patent Title (中): 集成电路和优化应变诱导复合材料的方法
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Application No.: US13214056Application Date: 2011-08-19
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Publication No.: US08765541B1Publication Date: 2014-07-01
- Inventor: Girish Venkitachalam , Che Ta Hsu , Fangyun Richter , Peter J. McElheny
- Applicant: Girish Venkitachalam , Che Ta Hsu , Fangyun Richter , Peter J. McElheny
- Applicant Address: US CA San Jose
- Assignee: Altera Corporation
- Current Assignee: Altera Corporation
- Current Assignee Address: US CA San Jose
- Agency: Womble Carlyle Sandridge & Rice LLP
- Main IPC: H01L21/8238
- IPC: H01L21/8238
Abstract:
A method to design an IC is disclosed to provide a uniform deposition of strain-inducing composites is disclosed. The method to design the IC comprises, determining a total strain-inducing deposition area on an IC design. Then, the total strain inducing deposition area is compared with a predefined size. A dummy diffusion area is modified to increase the total strain-inducing deposition area, when the total strain-inducing deposition area is below the predefined size. Finally, the strain-inducing deposition area is optimized. A method to manufacture the IC and the IC is also disclosed.
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