Invention Grant
- Patent Title: Capacitors and methods of manufacture thereof
- Patent Title (中): 电容器及其制造方法
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Application No.: US14017022Application Date: 2013-09-03
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Publication No.: US08765548B2Publication Date: 2014-07-01
- Inventor: Martin Ostermayr , Richard Lindsay
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/8242
- IPC: H01L21/8242

Abstract:
Semiconductor devices, capacitors, and methods of manufacture thereof are disclosed. In one embodiment, a method of fabricating a capacitor includes forming a first material over a workpiece, and patterning the first material, forming a first capacitor plate in a first region of the workpiece and forming a first element in a second region of the workpiece. A second material is formed over the workpiece and over the patterned first material. The second material is patterned, forming a capacitor dielectric and a second capacitor plate in the first region of the workpiece over the first capacitor plate and forming a second element in a third region of the workpiece.
Public/Granted literature
- US20140004670A1 Capacitors and Methods of Manufacture Thereof Public/Granted day:2014-01-02
Information query
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