Invention Grant
- Patent Title: Method of fabricating strained structure in semiconductor device
- Patent Title (中): 制造半导体器件中应变结构的方法
-
Application No.: US12645834Application Date: 2009-12-23
-
Publication No.: US08765556B2Publication Date: 2014-07-01
- Inventor: Yu-Rung Hsu , Chen-Hua Yu , Chao-Cheng Chen , Ming-Huan Tsai , Hsien-Hsin Lin , Hsueh-Chang Sung
- Applicant: Yu-Rung Hsu , Chen-Hua Yu , Chao-Cheng Chen , Ming-Huan Tsai , Hsien-Hsin Lin , Hsueh-Chang Sung
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
The present disclosure provides a semiconductor device that includes a semiconductor substrate, a gate structure disposed on a portion of the substrate, and strained structures disposed at either side of the portion of the substrate and formed of a semiconductor material different from the semiconductor substrate. The portion of the substrate is T shaped having a horizontal region and a vertical region that extends from the horizontal region in a direction away from a surface of the substrate.
Public/Granted literature
- US20110147810A1 METHOD OF FABRICATING STRAINED STRUCTURE IN SEMICONDUCTOR DEVICE Public/Granted day:2011-06-23
Information query
IPC分类: