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US08765556B2 Method of fabricating strained structure in semiconductor device 有权
制造半导体器件中应变结构的方法

Method of fabricating strained structure in semiconductor device
Abstract:
The present disclosure provides a semiconductor device that includes a semiconductor substrate, a gate structure disposed on a portion of the substrate, and strained structures disposed at either side of the portion of the substrate and formed of a semiconductor material different from the semiconductor substrate. The portion of the substrate is T shaped having a horizontal region and a vertical region that extends from the horizontal region in a direction away from a surface of the substrate.
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