Invention Grant
- Patent Title: Process for producing laminated substrate and laminated substrate
- Patent Title (中): 叠层基板和叠层基板的制造方法
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Application No.: US12550340Application Date: 2009-08-28
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Publication No.: US08765576B2Publication Date: 2014-07-01
- Inventor: Shoji Akiyama , Atsuo Ito , Yoshihiro Kubota , Koichi Tanaka , Makoto Kawai , Yuuji Tobisaka
- Applicant: Shoji Akiyama , Atsuo Ito , Yoshihiro Kubota , Koichi Tanaka , Makoto Kawai , Yuuji Tobisaka
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L21/762 ; H01L21/3105
Abstract:
A method of manufacturing a laminated substrate is provided. The method includes: forming an oxide film on at least a surface of a first substrate having a hardness of equal to or more than 150 GPa in Young's modulus, and then smoothing the oxide film; implanting hydrogen ions or rare gas ions, or mixed gas ions thereof from a surface of a second substrate to form an ion-implanted layer inside the substrate, laminating the first substrate and the second substrate through at least the oxide film, and then detaching the second substrate in the ion-implanted layer to form a laminated substrate; heat-treating the laminated substrate and diffusing outwardly the oxide film.
Public/Granted literature
- US20100084746A1 PROCESS FOR PRODUCING LAMINATED SUBSTRATE AND LAMINATED SUBSTRATE Public/Granted day:2010-04-08
Information query
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