Invention Grant
- Patent Title: Etching process for semiconductors
- Patent Title (中): 半导体蚀刻工艺
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Application No.: US12917826Application Date: 2010-11-02
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Publication No.: US08765611B2Publication Date: 2014-07-01
- Inventor: Michael A. Haase , Terry L. Smith , Jun-Ying Zhang
- Applicant: Michael A. Haase , Terry L. Smith , Jun-Ying Zhang
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Agent Steven E. Skolnick
- Main IPC: H01L21/027
- IPC: H01L21/027

Abstract:
A process for etching semiconductors, such as II-VI or III-V semiconductors is provided. The method includes sputter etching the semiconductor through an etching mask using a nonreactive gas, removing the semiconductor and cleaning the chamber with a reactive gas. The etching mask includes a photoresist. Using this method, light-emitting diodes with light extracting elements or nano/micro-structures etched into the semiconductor material can be fabricated.
Public/Granted literature
- US20110108956A1 ETCHING PROCESS FOR SEMICONDUCTORS Public/Granted day:2011-05-12
Information query
IPC分类: