Invention Grant
- Patent Title: Thermosetting polymer-based composite materials
- Patent Title (中): 热固性聚合物基复合材料
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Application No.: US13861475Application Date: 2013-04-12
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Publication No.: US08765856B2Publication Date: 2014-07-01
- Inventor: Xiujun Wang
- Applicant: Globe Composite Solutions, Ltd.
- Applicant Address: US MA Rockland
- Assignee: Globe Composite Solutions, Ltd.
- Current Assignee: Globe Composite Solutions, Ltd.
- Current Assignee Address: US MA Rockland
- Agency: MKG, LLC
- Main IPC: C04B28/14
- IPC: C04B28/14
Abstract:
A lead-free, non-toxic composite material including a thermosetting polymer and at least one of a heavy particulate filler, a light particulate filler or a combination thereof. The composite material may be utilized in manufacturing articles used in radiation shielding applications.
Public/Granted literature
- US20140151605A1 THERMOSETTING POLYMER-BASED COMPOSITE MATERIALS Public/Granted day:2014-06-05
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