Invention Grant
- Patent Title: Polyphenylene sulfide resin composition with improved thermal conductivity and surface appearance and articles thereof
- Patent Title (中): 具有改善导热性和表面外观的聚苯硫醚树脂组合物及其制品
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Application No.: US13723363Application Date: 2012-12-21
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Publication No.: US08765858B2Publication Date: 2014-07-01
- Inventor: Chan Gyun Shin , Jong Cheol Lim , Jeong Won Lee , Nam Hyun Kim
- Applicant: Cheil Industries Inc.
- Applicant Address: KR Gumi-si,
- Assignee: Cheil Industries Inc.
- Current Assignee: Cheil Industries Inc.
- Current Assignee Address: KR Gumi-si,
- Agency: Additon, Higgins, Pendleton & Ashe, P.A.
- Priority: KR10-2011-0146941 20111230
- Main IPC: C08K3/28
- IPC: C08K3/28
Abstract:
A polyphenylene sulfide resin composition comprises (A) about 30 to about 50% by weight of a polyphenylene sulfide resin; (B) about 1 to about 5% by weight of an amorphous polyamide resin; and (C) about 45 to about 69% by weight thermally conductive insulating fillers.
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