Invention Grant
- Patent Title: Resin composition for insulating film or surface-protective film of electronic components, method for producing pattern-cured film and electronic components
- Patent Title (中): 电子部件用绝缘膜或表面保护膜用树脂组合物,图案固化膜及电子部件的制造方法
-
Application No.: US12771756Application Date: 2010-04-30
-
Publication No.: US08765868B2Publication Date: 2014-07-01
- Inventor: Hajime Nakano
- Applicant: Hajime Nakano
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical DuPont Microsystems, Ltd.
- Current Assignee: Hitachi Chemical DuPont Microsystems, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Griffin & Szipl, P.C.
- Priority: JP2009-179058 20090731
- Main IPC: C08G18/42
- IPC: C08G18/42 ; C08G18/46 ; B44C1/00 ; G03F7/00

Abstract:
A resin composition includes: (A) a polymer having a structural unit shown by the formula (I), and an acidic functional group or a group derived therefrom at both of the terminals; wherein X1 is a di- to octa-valent organic group, Y1 is a di- to octa-valent organic group, R1 is a hydrogen atom or an organic group having 1 to 20 carbon atoms, R2 is a hydrogen atom or a monovalent organic group, when plural R1s or R2s exist, the plural R1s or R2s may be the same or different, p and q are independently an integer of 0 to 4, l and m are independently an integer of 0 to 2, and n is an integer of 2 or more indicating the number of structural units; (B) a solvent; and (C) a compound shown by formula (II) wherein R3 is a monovalent organic group.
Public/Granted literature
Information query