Invention Grant
- Patent Title: Compound, resin composition, and resin molded article
- Patent Title (中): 化合物，树脂组合物和树脂模制品
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Application No.: US13206051Application Date: 2011-08-09
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Publication No.: US08765990B2Publication Date: 2014-07-01
- Inventor: Kenji Yao
- Applicant: Kenji Yao
- Applicant Address: JP Tokyo
- Assignee: Fuji Xerox Co., Ltd.
- Current Assignee: Fuji Xerox Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2011-027702 20110210
- Main IPC: C08K5/12
- IPC: C08K5/12 ; C08L11/00 ; C08L31/00 ; C08L77/00 ; C07C69/96
Abstract:
Disclosed is a compound represented by formula (1): wherein R1 and R3 each independently represent an alkylene group having 1 to 10 carbon atoms or an arylene group; R2 and R4 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an aryl group; and l, n and m each independently represent a natural number of 1 to 3.
Public/Granted literature
- US20120204755A1 COMPOUND, RESIN COMPOSITION, AND RESIN MOLDED ARTICLE Public/Granted day:2012-08-16
Information query
