A chip support board structure which includes at least a metal substrate, a block layer, a paddle, an insulation layer, a circuit layer and a solder resist is disclosed. The circuit layer connects with the paddle. The material of the block layer is different from that of the metal substrate and the block layer is provided between the metal substrate and the paddle such that the shape and the depth of the paddle is maintained constant and the problem of different depth and easily peeling off is avoided, thereby improving the yield rate of the chip support board.