Invention Grant
- Patent Title: Solid-state imaging device and method of manufacturing the same, and imaging apparatus
- Patent Title (中): 固态成像装置及其制造方法以及成像装置
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Application No.: US13137093Application Date: 2011-07-20
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Publication No.: US08766156B2Publication Date: 2014-07-01
- Inventor: Atsushi Kawashima , Katsunori Hiramatsu , Yasufumi Miyoshi
- Applicant: Atsushi Kawashima , Katsunori Hiramatsu , Yasufumi Miyoshi
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rader, Fishman & Grauer PLLC
- Priority: JP2010-169911 20100729
- Main IPC: H01L27/146
- IPC: H01L27/146
Abstract:
A solid-state imaging device includes: a semiconductor substrate provided with an effective pixel region including a light receiving section that photoelectrically converts incident light; an interconnection layer that is provided at a plane side opposite to the light receiving plane of the semiconductor substrate; a first groove portion that is provided between adjacent light receiving sections and is formed at a predetermined depth from the light receiving plane side of the semiconductor substrate; and an insulating material that is embedded in at least a part of the first groove portion.
Public/Granted literature
- US20120025059A1 Solid-state imaging device and method of manufacturing the same, and imaging apparatus Public/Granted day:2012-02-02
Information query
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