Invention Grant
- Patent Title: Pixel structure and manufacturing method thereof
- Patent Title (中): 像素结构及其制造方法
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Application No.: US13004034Application Date: 2011-01-11
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Publication No.: US08766270B2Publication Date: 2014-07-01
- Inventor: Hsiu-Chun Hsieh , Yi-Wei Chen , Ta-Wei Chiu , Chung-Tao Chen
- Applicant: Hsiu-Chun Hsieh , Yi-Wei Chen , Ta-Wei Chiu , Chung-Tao Chen
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW99129120A 20100830
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L29/04 ; H01L29/10 ; H01L21/00 ; H01L27/12

Abstract:
A pixel structure is provided. A first insulating pattern is on the first polysilicon pattern. A second insulating pattern is on the second polysilicon pattern and separated from the first insulating pattern. An insulating layer covers the first and the second insulating patterns. A first gate and a second gate are on the insulating layer. A first covering layer covers the first and the second gates. A first source metal layer and a first drain metal layer are on the first covering layer and electrically connected to a first source region and a first drain region. A second source metal layer and a second drain metal layer are on the first covering layer and electrically connected to a second source region and a second drain region. A pixel electrode is electrically connected to the first drain metal layer.
Public/Granted literature
- US20120049197A1 PIXEL STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2012-03-01
Information query
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