Invention Grant
- Patent Title: Semiconductor device and method of manufacturing semiconductor device
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13678784Application Date: 2012-11-16
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Publication No.: US08766276B2Publication Date: 2014-07-01
- Inventor: Masayasu Tanaka
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-255167 20111122; JP2012-199932 20120911
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L31/0256

Abstract:
A nitride semiconductor layer formed from a nitride semiconductor is provided on at least one surface side of a semiconductor substrate. Impurity regions (a source region, a drain region, and the like) are provided on one surface side in the nitride semiconductor layer and contain an impurity of a first conductivity type. In addition, amorphous regions (a first amorphous region and a second amorphous region) are a part of the impurity regions and are located in a surface layer of the impurity regions. In addition, metallic layers (a source electrode and a drain electrode) come into contact with the amorphous regions (the first amorphous region and the second amorphous region).
Public/Granted literature
- US20130126893A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2013-05-23
Information query
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