Invention Grant
- Patent Title: Light-emitting diode arrangement with heat dissipating plate
- Patent Title (中): 发光二极管配置散热板
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Application No.: US10578362Application Date: 2004-11-03
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Publication No.: US08766283B2Publication Date: 2014-07-01
- Inventor: Stefan Tasch , Hans Hoschopf
- Applicant: Stefan Tasch , Hans Hoschopf
- Applicant Address: AT Jennersdorf
- Assignee: Tridonic Optoelectronics GmbH
- Current Assignee: Tridonic Optoelectronics GmbH
- Current Assignee Address: AT Jennersdorf
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: DE10351934 20031107
- International Application: PCT/EP2004/012438 WO 20041103
- International Announcement: WO2005/048358 WO 20050526
- Main IPC: H01L27/15
- IPC: H01L27/15
Abstract:
The invention relates to a light-emitting arrangement, having:—at least one light-emitting diode chip (1),—a multi-layer board (17) having a base (5) of a thermally well conducting material, in particular of metal, and—an electrical insulating and thermally conducting connection layer (2) between the emission surface of the light-diode chip (1) and the board (17).
Public/Granted literature
- US20070138488A1 Light-emitting diode arrangement with heat dissipating plate Public/Granted day:2007-06-21
Information query
IPC分类:
