Invention Grant
- Patent Title: Semiconductor light emitting device and method of fabricating semiconductor light emitting device
- Patent Title (中): 半导体发光器件及半导体发光器件的制造方法
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Application No.: US13689841Application Date: 2012-11-30
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Publication No.: US08766305B2Publication Date: 2014-07-01
- Inventor: Toru Gotoda , Toshiyuki Oka , Shinya Nunoue , Kotaro Zaima
- Applicant: Toru Gotoda , Toshiyuki Oka , Shinya Nunoue , Kotaro Zaima
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-052220 20100309
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
A semiconductor light emitting device has a light emitting element, a first electrode layer, a second electrode layer, a seed electrode layer and a plated layer. The light emitting element has a nitride-based III-V compound semiconductor on a substrate and a light extraction surface. The first electrode layer is provided on the light extraction surface. The second electrode layer is provided on a surface opposite to the light extraction surface. The seed electrode layer is configured to cover the entire surface of the second electrode layer. The plated layer is provided on the seed electrode layer. The light emitting element has a light emitting layer, first conductive type semiconductor layer, and second conductive type semiconductor layer, and has a forward tapered shape of a width which gradually narrows in order of the second conductive type semiconductor layer, the light emitting layer and the first conductive type semiconductor layer.
Public/Granted literature
- US20130153922A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR LIGHT EMITTING DEVICE Public/Granted day:2013-06-20
Information query
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