Invention Grant
US08766317B2 Semiconductor device 有权
半导体器件

  • Patent Title: Semiconductor device
  • Patent Title (中): 半导体器件
  • Application No.: US12665538
    Application Date: 2008-06-17
  • Publication No.: US08766317B2
    Publication Date: 2014-07-01
  • Inventor: Masaru Takaishi
  • Applicant: Masaru Takaishi
  • Applicant Address: JP Kyoto
  • Assignee: Rohm Co., Ltd.
  • Current Assignee: Rohm Co., Ltd.
  • Current Assignee Address: JP Kyoto
  • Agency: Fish & Richardson P.C.
  • Priority: JP2007-160235 20070618; JP2007-160242 20070618; JP2007-160245 20070618
  • International Application: PCT/JP2008/061019 WO 20080617
  • International Announcement: WO2008/156070 WO 20081224
  • Main IPC: H01L29/66
  • IPC: H01L29/66
Semiconductor device
Abstract:
Provided is a semiconductor device in which on-resistance is largely reduced based on a new principle of operation. In the semiconductor device, if an embedded electrode is at negative potential, a depletion layer is formed from a trench to a neighboring trench so that a channel is turned off. If the embedded electrode is at a positive potential, the depletion layer is not formed in every region between the neighboring trenches so that the channel is turned on.
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